- Applications: Audio, Communications and Telecom, Consumer Electronics, Energy, Industrial, Medical, Security, Space, Avionics and Defense, Video and Imaging
- IO Supply: 1.8, 3.0 (MMC1 Only)V
- On-Chip L1 Cache: 112 KB (DSP), 32 KB (ARM Cortex-A8)
- General Purpose Memory: Asynch SRAM, GPMCNAND flash, NOR Flash, OneNAND
- DMA: 64-Ch EDMA, 32-Bit Channel SDMA
- McBSP: 5
- MMC/SD: 3
- Video Capability: Decode, Encode, Analytics, Image Enhance
- TI Audio Codecs: AAC-HE, AAC-LC, G.711, MP3, WMA
- TI Video Codecs: AAC-HE, AAC-LC, G.711, MP3, WMA
Texas Instruments
Electrical Datasheet
Die Physical Data:
Footprint: 56.090mm² (86940mil²)
Request Pad Layout
- I2C: 1
- SPI: 1
- ARM CPU: 1 ARM Cortex-A8
- DRAM: 1 16-bit LPDDR, 1 32-bit SDRC
- DSP: 1 C64x
- DSP Instruction: Fixed Point
- Operating Systems: Android, Neutrino, Integrity, Tornado, Windows Embedded CE, Linux, VXWorks
- UART (SCI): 1
- USB: 1
- Video Port (Configurable): Decode, Encode, Analytics, Image Enhance
DSP MHz(Max): 520MHz
L2 Cache: 256 KB (ARM Cortex-A8), 96 KB (DSP)KB
- Green:Available from stock or at low factory MOQ.
- Amber: Available on factory order with MOQ.
- Red: High factory MOQ may apply, please ask for details.
- Green: This bare die is specified and tested for use in high reliability applications.
- Amber: This bare die can meet higher reliability specifications with additional testing & qualification, please ask for details.
- Red: This bare die is not specified or specifically designed for use in high reliability applications.
- Green: This bare die is qualified for space applications or has space level qualification data, please ask for details.
- Amber: This bare die can be specified for space applications with additional testing and qualification, please ask for details.
- Red: Suitability of this bare die for space applications is unknown and requires further qualification, please ask for details.